
Altium Develop is a collaborative platform for modern electronics engineering teams that connects requirements management, PCB design, systems engineering, and manufacturing workflows.
Built on Altium Designer and Altium 365, the platform provides a centralized environment for design collaboration, requirements traceability, BOM management, supply chain visibility, and engineering change management.
Altium Develop helps hardware organizations maintain alignment between requirements, design decisions, and manufacturing outcomes while supporting distributed engineering teams through cloud-based collaboration.
Core Features:
• PCB design collaboration
• ECAD-MCAD co-design workflows
• Component and supply chain visibility
• BOM and engineering change management
• Design review and approval workflows
• Cloud-native team collaboration
• Requirements management and traceability
Used by electronics teams building complex PCB-based products, Altium Develop is frequently evaluated alongside Cadence OrCAD, Cadence Allegro, Autodesk Fusion Electronics, KiCad, Siemens Xpedition, and SOLIDWORKS PCB for organizations seeking greater collaboration and lifecycle visibility across hardware development programs.
Learn more
Azore is software for computational fluid dynamics. It analyzes fluid flow and heat transfers. CFD allows engineers and scientists to analyze a wide range of fluid mechanics problems, thermal and chemical problems numerically using a computer. Azore can simulate a wide range of fluid dynamics situations, including air, liquids, gases, and particulate-laden flow. Azore is commonly used to model the flow of liquids through a piping or evaluate water velocity profiles around submerged items. Azore can also analyze the flow of gases or air, such as simulating ambient air velocity profiles as they pass around buildings, or investigating the flow, heat transfer, and mechanical equipment inside a room. Azore CFD is able to simulate virtually any incompressible fluid flow model. This includes problems involving conjugate heat transfer, species transport, and steady-state or transient fluid flows.
Learn more
iGRAF
iGRAF is a comprehensive simulation tool that integrates powder and multiphase flow dynamics, effectively bridging the gap between these two domains. This innovative solution is tailored to accurately replicate a diverse array of powder behaviors while setting new benchmarks in simulation technology. With its advanced DEM-CFD solver, iGRAF provides users with the capability to perform precise analyses of both single-phase and multiphase flows, thereby enhancing the understanding of particle-fluid interactions within a unified platform. The tool's dynamic geometry control features allow for translations, rotations, vibrations, and customizable motion, enabling teams to effectively capture the intricate dynamics of complex systems. Additionally, it incorporates validated models for liquid bridging and van der Waals forces to evaluate the effects of moisture and adhesion on particle behavior, with its liquid bridge force model confirmed for moisture levels of up to 15%. Furthermore, iGRAF employs the Signed Distance Function along with the Immersed Boundary Method to adeptly identify and manage arbitrary solid geometries, ensuring flexibility in various applications. This versatility makes iGRAF an invaluable asset for researchers and engineers working with complex multiphase systems.
Learn more
Ansys Icepak
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Learn more