Best Web-Based PCB Design Software of 2025 - Page 3

Xpedition Enterprise stands out as a pioneering PCB design flow, seamlessly integrating every stage from initial system design to the final manufacturing execution. Its cutting-edge technologies can slash design timelines by over 50%, all while enhancing quality and resource utilization significantly. Xpedition fosters collaboration and integration across various platforms, including IC packaging, multi-board setups, RF, harnesses, FPGA, and MCAD, delivering the adaptability and user-friendly technologies essential for modern design processes. The software accommodates multi-user and multi-site environments, facilitating flow-based concurrent engineering throughout the entire product development lifecycle, which leads to remarkable reductions in design cycles and enhancements in product quality. Moreover, Xpedition's combination of user-friendly interfaces and robust automation empowers PCB designers with advanced tools to tackle today’s intricate design challenges effortlessly. By optimizing for both performance and manufacturability, it guarantees superior product quality while minimizing design errors and the need for rework. Ultimately, Xpedition Enterprise equips designers with the resources necessary to innovate and excel in a competitive landscape.

HyperLynx offers integrated capabilities for signal integrity, power integrity, 3D electromagnetic modeling, and electrical rule checking tailored for high-speed digital designs. By merging user-friendly features with automated processes, HyperLynx makes high-speed design analysis accessible for mainstream system designers, enabling early identification and resolution of potential issues within the design cycle. It seamlessly integrates with various PCB tools, making it a valuable addition to any PCB design workflow. The HyperLynx suite ensures a comprehensive analysis pipeline, fusing best-practice design rule checking with in-depth simulations for both signal and power integrity. Equipped with advanced 3D electromagnetic solvers, it produces precise interconnect models that enhance the design process. Users can assess design trade-offs during the pre-layout phase and confirm their designs before fabrication with thorough post-layout analyses. This tool supports a range of applications, including SerDes channels, DDRx memory interfaces, and general signal integrity assessments. Additionally, it simplifies the design and validation of a board's power-delivery network (PDN), facilitating compliance with impedance goals in a user-friendly setting. With its robust features, HyperLynx empowers engineers to create high-performance designs with confidence.

Embrace the future with the Sigrity X Platform, where cutting-edge innovation harmonizes with peak optimization. Gain access to unparalleled signal and power integrity for your PCB and IC package designs, propelling you far past the existing boundaries of signal integrity (SI) and power integrity (PI) technology. Picture yourself skillfully navigating the intricate challenges of electronic design, achieving not just your targets but exceeding them with remarkable efficiency and accuracy. With Sigrity X, you’re engaging with a transformative tool that fosters a seamless integration of in-design analysis within the Allegro X PCB and IC Package platforms. Immerse yourself in an extensive array of SI/PI analysis, in-design interconnect modeling, and PDN analysis tools that are specifically engineered to elevate your performance, ensuring that your projects consistently surpass expectations and stay within timeframes and budgets. Leverage the capabilities of the Sigrity X Platform to guarantee exceptional performance and reliability in your upcoming designs, setting a new standard for success. This is your opportunity to redefine what is possible in electronic design and lead the way in innovation.

Sigrity X Advanced SI Technology offers advanced signal integrity analysis for PCBs and IC packaging, covering DC up to 56GHz, with features such as automated die-todie SI analysis, topology exploring, and simulation of high-speed interfaces. It supports IBIS-AMI and customizable compliance kits to ensure that your designs meet rigorous standards.

CADSTAR stands out as a well-established desktop solution for PCB design, boasting a substantial global user base of satisfied customers. This professional and robust software is designed to be both accessible and budget-friendly, ensuring it aligns perfectly with your design needs and financial considerations. Supported by knowledgeable local resellers, CADSTAR offers comprehensive training, ongoing support, integration, and consultancy services that enhance your investment's value. Tailored for small to mid-sized design teams, this software also caters to individual designers and larger corporations with multiple locations. The complete PCB design environment provided by CADSTAR covers everything from the initial concept stage all the way to product realization. With its integrated suite of applications, engineers can easily define, visualize, execute, and validate their designs, ensuring a streamlined workflow. It features schematic capture along with a placement and constraint planner, as well as constraint-driven options for both interactive and automated PCB layout and routing, making it an all-encompassing tool for modern design challenges.

Cadence®, Sigrity X OptimizationPI™ technology performs a complete AC frequency analyzer of boards and IC package to ensure high performance and save between 15% and 50 % in decoupling capacitor costs. It supports both pre-and post-layout studies and quickly pinpoints the most cost-effective decap selections. Sigrity X OptimizePI is based on proven Cadence hybrid magnetic circuit analysis technology combined with the unique Sigrity Optimization engine to help you quickly identify the best possible placement and decap locations.

Cadence Celsius PowerDC technology offers efficient DC analysis to ensure reliable power delivery. This includes electrical/thermal simulations for maximum accuracy. The Celsius PowerDC technology quickly identifies areas of excessive IR drop and thermal hotspots to minimize the risk of failure of your design. Highly accurate, even with complex designs that have multiple voltage domains, complex plane structures and multiple voltage domains, providing conclusive IR analysis for board and package. DC simulations can be automatically set up using PowerTree Technology (source/sink defintions) captured during the schematic stage of design. Support for multi-structures, including stacked boards, multiple die, and all popular packaging types.

Cadence®, Sigrity X PowerSI® technology helps you to tackle increasingly difficult issues related switching noise, signal coupling and target voltage levels. It provides fast, accurate and detailed electrical analyses of full IC packages and PCBs. It can be used to develop power and signal integrity guidelines before layout, or after layout to verify performance and improve the design without a prototype. Sigrity X's electromagnetic (EM) solver technology allows you to perform a wide range of studies, including identifying trace and via coupling problems, power/ground fluctuation caused by simultaneously switching out put, and designing regions that are below or above voltage targets. PowerSI technology allows you to extract frequency-dependent parameter models for network networks and visualize complex spatial relationships.

JTAG Maps™, an intuitive Altium extension, allows engineers to quickly assess test possibilities provided by the JTAG devices in their design. Engineers used to spend hours manually highlighting boundary-scan nets in a design to determine coverage. Boundary scan device model files (BSDLs), which indicate exactly which pins can or cannot be controlled by JTAG/boundary scanning, are crucial to any JTAG/boundary scanner process. JTAG Maps is compatible with BSDL models, and has an 'assume scanner covered' option. Although most users will prefer to use the JTAG Maps Altium coverage report, it is possible import a more detailed picture. The data can be exported to JTAG ProVision for further analysis. A simple message file containing full fault-coverage information can then be read back into JTAG Maps for display/highlighting.