Compare Sentaurus Process vs. VPS-MICRO

Sentaurus Process serves as a sophisticated simulator in one, two, and three dimensions, specifically designed for the advancement and fine-tuning of silicon semiconductor process technologies. This next-generation tool effectively tackles the complexities associated with both contemporary and forthcoming process technologies. Featuring an array of cutting-edge process models, including standardized parameters that have been calibrated using data from equipment manufacturers, Sentaurus Process offers a robust framework for accurately simulating a diverse spectrum of technologies, ranging from nanoscale CMOS to expansive high-voltage power devices. Additionally, it integrates seamlessly into a complete suite of essential TCAD products, facilitating multi-dimensional simulations of processes, devices, and systems through an intuitive user interface. With its capabilities for rapid prototyping, development, and optimization, Sentaurus Process enables extensive physics-based process modeling. Furthermore, it allows for the enhancement of device performance by carefully optimizing the thermal and mechanical stress within process structures, accounting for historical stress factors. In this way, Sentaurus Process not only addresses current needs but also prepares users for future technological advancements.

VPS-MICRO estimates the lifespan of manufactured components by modeling the characteristics of their constituent materials. This innovative software is founded on three fundamental principles. First, durability is influenced not just by the stress applied but also by how the material responds to that stress. Second, the materials used in creating intricate components and systems often exhibit non-uniform properties. Lastly, computational resources are more cost-effective and quicker compared to traditional physical testing or prototyping methods. Building upon these concepts, VEXTEC’s VPS-MICRO® serves as a sophisticated computational tool that effectively considers a material’s response to imposed stress, its inherent variability, various damage mechanisms, geometric factors, and the operational conditions over time. Consequently, it produces a three-dimensional, time-sensitive simulation that reliably mirrors the real-world physics behind the onset, progression, and reasons for material damage, offering valuable insights for engineers and designers alike. This capability not only enhances understanding but also aids in improving the design and reliability of future products.