Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Lenovo's high-density systems provide significant computational power within a compact footprint, making them ideal for demanding tasks such as High-Performance Computing (HPC), Artificial Intelligence (AI), cloud services, grid computing, and data analytics. In today's fast-paced technological environment, it's crucial for servers to feature contemporary designs. Our high-density servers are equipped to handle even the most intricate simulations effortlessly. These robust systems are specifically engineered to meet your needs across the fields of artificial intelligence, cloud computing, grid services, and analytics. Furthermore, designed with scalability in mind, our innovative water-cooled solutions prioritize security while maximizing density. Combining liquid cooling technology with exemplary energy efficiency, the ThinkSystem stands out as a smart choice. This approach ensures that all the processing power you require is housed in a sleek and efficient package. By employing advanced heat removal techniques that outperform traditional air cooling, essential components maintain lower operating temperatures, leading to enhanced performance in a system that runs quietly and efficiently. Ultimately, Lenovo's dense systems represent a blend of power, security, and innovation, making them a valuable asset for any modern enterprise.
Description
The 3U systems can accommodate 24, 12, or 8 nodes, featuring 4 DIMM slots each, with options for hot-swappable 3.5” or 2.5” NVMe/SAS3/SATA3 drives. Enhanced by onboard 10 Gigabit Ethernet, these systems are designed for optimal cost-effectiveness. The MicroCloud’s modular design ensures high density, ease of maintenance, and affordability, which are critical for modern hyper-scale operations. Integrated within a compact 3U chassis measuring under 30 inches in depth, these modular server nodes can save over 76% of rack space compared to conventional 1U servers. This family of MicroCloud servers specializes in single socket computing, optimized for hyper-scale data centers, utilizing the latest power-efficient and high-density system-on-chip (SoC) processors, including the Intel® Xeon® E/D/E3/E5 and Intel® Atom® C Processors, allowing for diverse and scalable cloud and edge computing solutions. Conveniently, power and I/O ports are positioned at the front of the chassis, facilitating quick server provisioning, upgrades, and maintenance tasks, enhancing operational efficiency further.
API Access
Has API
No
API Access
Has API
No
Integrations
GB Network Solutions
No
GPU.ai
No
RAVEL Orchestrate
No
Relianoid
No
Stor2RRD
Yes
StorMagic SvSAN
Yes
TensorWave
No
Windows Admin Center
Yes
Integrations
GB Network Solutions
Yes
GPU.ai
Yes
RAVEL Orchestrate
Yes
Relianoid
Yes
Stor2RRD
No
StorMagic SvSAN
No
TensorWave
Yes
Windows Admin Center
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
Yes
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Vendor Details
Company Name
Lenovo
Country
United States
Website
www.lenovo.com/us/en/c/servers-storage/servers/high-density/
Vendor Details
Company Name
Supermicro
Country
United States
Website
www.supermicro.com/en/products/microcloud