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features
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Description

Providing adaptable performance options tailored for data centers of varying sizes, this system supports advanced storage technologies such as E3.S and E1.S, PCIe Gen5, and CXL. It sets a new standard for power efficiency by enhancing PSU density by as much as 4%. Promoting open collaboration significantly boosts product reliability and operational efficiency. An increase in redundancy for BIOS/BMC and critical components ensures stable performance, while enhanced security measures such as boot memory inspection and MFP memory protection fortify system integrity. Software-designed hardware redundancy minimizes both system downtime and energy consumption. Cloud-driven operations and maintenance achieve fault diagnosis accuracy of up to 95%. Comprehensive liquid cooling solutions are in place, alongside intelligent temperature management and hardware designs that optimize heat dissipation. Innovative packing technology leads to a 90% reduction in material volume and a 30% decrease in plastic waste. Additionally, dynamic power management facilitates a 15% reduction in energy use, all while providing real-time monitoring of carbon emissions. As a result, this holistic approach not only enhances performance but also drives sustainability in data center operations.

Description

Advanced systems featuring both rear and front I/O setups ensure exceptional performance. They incorporate blazing-fast storage solutions utilizing the latest PCIe 5.0 NVMe SSD technology. These systems provide networking versatility with support for AIOM NICs that comply with OCP 3.0 standards. Designed for peak performance and adaptability, they cater specifically to enterprise and telecom applications. Telco-optimized models boast short-depth, carrier-grade Hyper-E servers that meet NEBS Level 3 requirements. The innovative toolless design enhances serviceability, effectively reducing maintenance time. With an impressive capacity of up to 32 DIMM slots and a maximum memory of 8TB DDR5-4800, these systems also accommodate Intel® Optane™ persistent memory. They feature redundant power supplies rated at 2000W, 1300W, or 1200W with a Titanium efficiency level of 96%. Additionally, they support dual 4th Gen Intel® Xeon® Scalable processors with a TDP of up to 350W. Users can also utilize up to 24 hot-swap NVMe, SATA, or SAS drive bays, with optional RAID functionality available through AOC. This combination of features ensures that these systems are not only powerful but also incredibly versatile for a range of demanding applications.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

No details available.

Integrations

No details available.

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Inspur

Country

United States

Website

www.inspursystems.com/g7-series/

Vendor Details

Company Name

Supermicro

Country

United States

Website

www.supermicro.com/en/products/hyper

Product Features

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