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Description
Ansys Sherlock stands out as the sole reliability physics-based tool for electronics design that delivers quick and precise life expectancy assessments for electronic components, boards, and systems during the initial design phases. By automating the design analysis process, Ansys Sherlock enables the rapid generation of life predictions, thus eliminating the "test-fail-fix-repeat" cycle that often hampers development. Designers can effectively model the interactions between silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies, allowing for accurate predictions of potential failure risks stemming from thermal, mechanical, and manufacturing stresses, all prior to creating prototypes. Additionally, Sherlock's extensive libraries, which house over 500,000 components, facilitate the seamless transformation of electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each of these models is equipped with precise geometries and material properties, ensuring that stress information is accurately conveyed for reliable predictions. This capability not only enhances design efficiency but also significantly reduces the risk of costly errors in the later stages of product development.
Description
Experience the full spectrum of heat transfer processes, encompassing convection, radiation, storage, and dissipation, while addressing both steady-state and transient environmental conditions. TAITherm thermal analysis software combines simplicity with robust capabilities, effectively handling solar and thermal radiation, convection, and conduction in various dynamic environments. By alleviating the complexities associated with thermal simulations, TAITherm guarantees that your designs will perform at their best in practical situations. Engineers and teams worldwide rely on TAITherm, utilizing it for diverse applications that span cutting-edge developments in fields such as automotive, electronics, wearables, military technology, architecture, and beyond. Our clients are at the forefront of innovation, leveraging thermal simulations and analysis to enhance usability, safety, and efficiency in their respective domains, ultimately pushing the limits of technological advancement. With TAITherm, the future of thermal analysis is not only accessible but also transformative for industries striving for excellence.
API Access
Has API
Yes
API Access
Has API
No
Integrations
No details available.
Integrations
No details available.
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-sherlock
Vendor Details
Company Name
ThermoAnalytics
Founded
1996
Country
United States
Website
www.thermoanalytics.com/taitherm
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
No
Finite Element Analysis
No
Fluid Dynamics
No
Import / Export Files
No
Integrated 3D Modeling
No
Manufacturing Process Simulation
No
Mechanical Event Simulation
No
Multibody Dynamics
No
Thermal Analysis
No
