Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys LS-DYNA stands out as the leading explicit simulation software widely utilized for various applications, including drop testing, impact analysis, penetration scenarios, collisions, and ensuring occupant safety. Renowned as the most extensively used explicit simulation tool globally, Ansys LS-DYNA excels in modeling the behavior of materials subjected to brief yet intense loading conditions. Its comprehensive suite of elements, contact formulations, and material models enables the simulation of intricate models while allowing precise control over every aspect of the issue at hand. The software offers a broad range of analyses, boasting rapid and effective parallel processing capabilities. Engineers can investigate simulations that involve material failure, examining how such failures evolve through components or entire systems. Additionally, LS-DYNA adeptly manages models with numerous interacting parts or surfaces, ensuring that the interactions and load transfers between complex behaviors are accurately represented. This capability makes LS-DYNA an invaluable tool for engineers facing multifaceted simulation challenges.
Description
Ansys Sherlock stands out as the sole reliability physics-based tool for electronics design that delivers quick and precise life expectancy assessments for electronic components, boards, and systems during the initial design phases. By automating the design analysis process, Ansys Sherlock enables the rapid generation of life predictions, thus eliminating the "test-fail-fix-repeat" cycle that often hampers development. Designers can effectively model the interactions between silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies, allowing for accurate predictions of potential failure risks stemming from thermal, mechanical, and manufacturing stresses, all prior to creating prototypes. Additionally, Sherlock's extensive libraries, which house over 500,000 components, facilitate the seamless transformation of electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each of these models is equipped with precise geometries and material properties, ensuring that stress information is accurately conveyed for reliable predictions. This capability not only enhances design efficiency but also significantly reduces the risk of costly errors in the later stages of product development.
API Access
Has API
No
API Access
Has API
Yes
Integrations
Simcenter 3D
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-ls-dyna
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-sherlock
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
No
Finite Element Analysis
No
Fluid Dynamics
No
Import / Export Files
No
Integrated 3D Modeling
No
Manufacturing Process Simulation
No
Mechanical Event Simulation
No
Multibody Dynamics
No
Thermal Analysis
No
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
No
Finite Element Analysis
No
Fluid Dynamics
No
Import / Export Files
No
Integrated 3D Modeling
No
Manufacturing Process Simulation
No
Mechanical Event Simulation
No
Multibody Dynamics
No
Thermal Analysis
No