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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

Description

Easily perform electrical stress analysis, MTBF calculation, component derating, and FMECA analysis within your ECAD during board design. Key Features: • Uses cutting-edge AI technologies for robust and efficient design. *Seamless Integration with leading ECAD Software for streamlined workflows and real-time analyses. *Includes automated circuit strain calculators to speed up design processes. • Performs detailed analysis on electrical stress derivation for components. *Utilizes the results of thermal simulation to improve derating accuracy. *Provides thermal resistance and stress metrics for 3D Thermal Simulations. *Identifies EOS violations using Pareto analysis, and detailed reports on overstress and overdesign. *Recommends design changes to effectively resolve overstress problems. *Utilizes derating guidelines for optimal component performance. *Automates FMECA Analysis

API Access

Has API No 

API Access

Has API No 

Screenshots View All

Screenshots View All

No images available

Integrations

Ansys Electronics Desktop (AEDT) Yes 
Ansys Fluent Yes 
BQR No 
apmOptimizer No 

Integrations

Ansys Electronics Desktop (AEDT) No 
Ansys Fluent No 
BQR Yes 
apmOptimizer Yes 

Pricing Details

No price information available.
Free Trial Yes 
Free Version No 

Pricing Details

No price information available.
Free Trial No 
Free Version No 

Deployment

Web-Based No 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux Yes 
Chromebook No 

Deployment

Web-Based No 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux No 
Chromebook No 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Customer Support

Business Hours No 
Live Rep (24/7) No 
Online Support No 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) No 
In Person Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) Yes 
In Person Yes 

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Vendor Details

Company Name

BQR Reliability Engineering

Founded

1989

Website

www.bqr.com

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