Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
EkkoSense provides a cloud-centered platform that leverages artificial intelligence, machine learning, and engaging 3D visualizations to furnish data center operators with immediate insights into thermal, power, and capacity metrics. This solution empowers teams to identify thermal and power threats at an early stage, enhance cooling effectiveness, track unused cooling resources, link cooling systems with IT workloads, accommodate both air- and liquid-cooling setups, and facilitate automated Environmental, Social, and Governance (ESG) reporting. With features such as an enterprise dashboard, digital twin representations, cooling advisory tools, and resources for capacity planning and power management, the software is tailored to unlock energy savings ranging from 10% to 40%, lower carbon footprints, and achieve a return on investment within a year. By incorporating wireless IoT sensors and utilizing data from existing Building Management Systems (BMS) or Power Distribution Units (PDU), it enables operational teams to manage their mechanical and electrical infrastructure more effectively and with greater assurance, extending from edge locations to large-scale facilities. Additionally, the platform's rapid deployment capability ensures that organizations can quickly adapt to changing operational needs.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
No
Live Training (Online)
Yes
In Person
Yes
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
EkkoSense
Founded
2013
Country
United Kingdom
Website
www.ekkosense.com
Product Features
Data Center Management
Audit Trail
No
Behavior-Based Acceleration
No
Cross Reference System
No
Device Auto Discovery
No
Diagnostic Testing
No
Import / Export Data
No
JCL Management
No
Multi-Platform
No
Multi-User
No
Power Management
No
Sarbanes-Oxley Compliance
No