Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Cadence Celsius PowerDC technology offers efficient DC analysis to ensure reliable power delivery. This includes electrical/thermal simulations for maximum accuracy. The Celsius PowerDC technology quickly identifies areas of excessive IR drop and thermal hotspots to minimize the risk of failure of your design.
Highly accurate, even with complex designs that have multiple voltage domains, complex plane structures and multiple voltage domains, providing conclusive IR analysis for board and package. DC simulations can be automatically set up using PowerTree Technology (source/sink defintions) captured during the schematic stage of design. Support for multi-structures, including stacked boards, multiple die, and all popular packaging types.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
Yes
Ansys Fluent
Yes
AutoCAD
No
CryptoTax360°
No
Sigrity X Platform
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
AutoCAD
Yes
CryptoTax360°
Yes
Sigrity X Platform
Yes
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
No
Live Rep (24/7)
Yes
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
No
Live Training (Online)
Yes
In Person
No
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
Cadence Design Systems
Founded
1988
Country
United States
Website
www.cadence.com
Product Features
PCB Design
3D Visualization
No
Autorouting
No
Collaboration Tools
No
Component Library
No
Design Rule Check
No
Differential Pair Routing
No
Schematic Editor
No