Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
Description
Ansys LS-DYNA stands out as the leading explicit simulation software widely utilized for various applications, including drop testing, impact analysis, penetration scenarios, collisions, and ensuring occupant safety. Renowned as the most extensively used explicit simulation tool globally, Ansys LS-DYNA excels in modeling the behavior of materials subjected to brief yet intense loading conditions. Its comprehensive suite of elements, contact formulations, and material models enables the simulation of intricate models while allowing precise control over every aspect of the issue at hand. The software offers a broad range of analyses, boasting rapid and effective parallel processing capabilities. Engineers can investigate simulations that involve material failure, examining how such failures evolve through components or entire systems. Additionally, LS-DYNA adeptly manages models with numerous interacting parts or surfaces, ensuring that the interactions and load transfers between complex behaviors are accurately represented. This capability makes LS-DYNA an invaluable tool for engineers facing multifaceted simulation challenges.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
Yes
Ansys Fluent
Yes
Simcenter 3D
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Simcenter 3D
Yes
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
No
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Deployment
Web-Based
Yes
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
No
Mac
No
Linux
No
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
No
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Vendor Details
Company Name
Ansys
Founded
1970
Country
United States
Website
www.ansys.com/products/structures/ansys-ls-dyna
Product Features
Computer-Aided Engineering (CAE)
CAD/CAM Compatibility
No
Finite Element Analysis
No
Fluid Dynamics
No
Import / Export Files
No
Integrated 3D Modeling
No
Manufacturing Process Simulation
No
Mechanical Event Simulation
No
Multibody Dynamics
No
Thermal Analysis
No