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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

Description

Ansys LS-DYNA stands out as the leading explicit simulation software widely utilized for various applications, including drop testing, impact analysis, penetration scenarios, collisions, and ensuring occupant safety. Renowned as the most extensively used explicit simulation tool globally, Ansys LS-DYNA excels in modeling the behavior of materials subjected to brief yet intense loading conditions. Its comprehensive suite of elements, contact formulations, and material models enables the simulation of intricate models while allowing precise control over every aspect of the issue at hand. The software offers a broad range of analyses, boasting rapid and effective parallel processing capabilities. Engineers can investigate simulations that involve material failure, examining how such failures evolve through components or entire systems. Additionally, LS-DYNA adeptly manages models with numerous interacting parts or surfaces, ensuring that the interactions and load transfers between complex behaviors are accurately represented. This capability makes LS-DYNA an invaluable tool for engineers facing multifaceted simulation challenges.

API Access

Has API No 

API Access

Has API No 

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT) Yes 
Ansys Fluent Yes 
Simcenter 3D No 

Integrations

Ansys Electronics Desktop (AEDT) No 
Ansys Fluent No 
Simcenter 3D Yes 

Pricing Details

No price information available.
Free Trial Yes 
Free Version No 

Pricing Details

No price information available.
Free Trial No 
Free Version No 

Deployment

Web-Based No 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux Yes 
Chromebook No 

Deployment

Web-Based Yes 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows No 
Mac No 
Linux No 
Chromebook No 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) No 
In Person Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) Yes 
In Person No 

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Vendor Details

Company Name

Ansys

Founded

1970

Country

United States

Website

www.ansys.com/products/structures/ansys-ls-dyna

Product Features

Product Features

Computer-Aided Engineering (CAE)

CAD/CAM Compatibility No 
Finite Element Analysis No 
Fluid Dynamics No 
Import / Export Files No 
Integrated 3D Modeling No 
Manufacturing Process Simulation No 
Mechanical Event Simulation No 
Multibody Dynamics No 
Thermal Analysis No 

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