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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Utilizing the Ansys Electronics solution suite significantly reduces testing expenses, guarantees adherence to regulations, enhances product reliability, and substantially shortens development timelines. This approach enables you to create advanced and superior products that stand out in the market. By harnessing Ansys' simulation capabilities, you can address the most vital elements of your designs effectively. Our solutions empower you to tackle critical issues in product design through comprehensive simulation. Whether you're involved in antenna, RF, microwave, PCB, package, IC design, or even electromechanical devices, we offer industry-leading simulators that serve as the gold standard. These tools assist you in overcoming various challenges related to electromagnetic forces, temperature variations, signal integrity, power integrity, parasitic effects, cabling, and vibrations in your designs. Furthermore, we enhance this process with thorough product simulation, which facilitates achieving first-pass success in designing complex systems such as airplanes, automobiles, smartphones, laptops, wireless chargers, and more. By integrating our solutions, you position yourself to excel in innovation and engineering excellence.

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

API Access

Has API No 

API Access

Has API No 

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT) No 
Ansys Fluent No 
Ansys HFSS Yes 
Ansys Icepak Yes 
Ansys Maxwell Yes 
Ansys Motor-CAD Yes 

Integrations

Ansys Electronics Desktop (AEDT) Yes 
Ansys Fluent Yes 
Ansys HFSS No 
Ansys Icepak No 
Ansys Maxwell No 
Ansys Motor-CAD No 

Pricing Details

No price information available.
Free Trial Yes 
Free Version No 

Pricing Details

No price information available.
Free Trial Yes 
Free Version No 

Deployment

Web-Based Yes 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux No 
Chromebook No 

Deployment

Web-Based No 
On-Premises No 
iPhone App No 
iPad App No 
Android App No 
Windows Yes 
Mac No 
Linux Yes 
Chromebook No 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Customer Support

Business Hours Yes 
Live Rep (24/7) No 
Online Support Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) Yes 
In Person Yes 

Types of Training

Training Docs Yes 
Webinars Yes 
Live Training (Online) No 
In Person Yes 

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

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