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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

Certified by Foundry, the AFS Platform provides nm SPICE accuracy, achieving speeds five times greater than conventional SPICE and more than twice as fast as parallel SPICE simulators. It stands out as the quickest nm circuit verification platform suitable for analog, RF, mixed-signal, and custom digital circuits. The latest addition of eXTreme technology enhances its capabilities. Specifically designed for large post-layout circuits, the AFS eXTreme technology accommodates over 100 million elements and operates three times faster than typical post-layout simulators. It is compatible with all leading digital solvers. With its top-tier usability, the platform maximizes the reuse of existing verification infrastructures, while its advanced verification and debugging features significantly enhance verification coverage. This results in improved design quality and reduced time-to-market. The platform guarantees SPICE accuracy and offers high-sigma verification, being a staggering 1000 times faster than brute-force simulation methods. It is user-friendly and easy to deploy, with access to AFS eXTreme technology provided at no extra cost; thus, it represents a comprehensive solution for modern circuit verification needs.

Description

Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Siemens

Founded

1847

Country

United States

Website

eda.sw.siemens.com/en-US/ic/analog-fastspice/

Vendor Details

Company Name

Ansys

Country

United States

Website

www.ansys.com/products/electronics/ansys-icepak

Product Features

Product Features

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