Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Certified by Foundry, the AFS Platform provides nm SPICE accuracy, achieving speeds five times greater than conventional SPICE and more than twice as fast as parallel SPICE simulators. It stands out as the quickest nm circuit verification platform suitable for analog, RF, mixed-signal, and custom digital circuits. The latest addition of eXTreme technology enhances its capabilities. Specifically designed for large post-layout circuits, the AFS eXTreme technology accommodates over 100 million elements and operates three times faster than typical post-layout simulators. It is compatible with all leading digital solvers. With its top-tier usability, the platform maximizes the reuse of existing verification infrastructures, while its advanced verification and debugging features significantly enhance verification coverage. This results in improved design quality and reduced time-to-market. The platform guarantees SPICE accuracy and offers high-sigma verification, being a staggering 1000 times faster than brute-force simulation methods. It is user-friendly and easy to deploy, with access to AFS eXTreme technology provided at no extra cost; thus, it represents a comprehensive solution for modern circuit verification needs.
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
API Access
Has API
API Access
Has API
Integrations
Ansys Electronics Desktop (AEDT)
Ansys Fluent
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Siemens
Founded
1847
Country
United States
Website
eda.sw.siemens.com/en-US/ic/analog-fastspice/
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak