Average Ratings 0 Ratings
Average Ratings 0 Ratings
Description
Ansys SpaceClaim offers a distinctive user interface, innovative modeling technology, and a versatile set of tools that facilitate the creation and modification of imported geometries without the intricacies often found in conventional CAD systems. While managing existing CAD models, users can effortlessly de-feature and streamline geometry using automated tools that are straightforward to master. This software is particularly suited for engineers who require rapid 3D solutions but lack the time to navigate elaborate CAD tools. SpaceClaim equips analysts with capabilities that expedite geometry preparation for simulations, whether that involves de-featuring CAD models, isolating fluid domains, or converting a model to beam and shell elements. By alleviating geometry-related obstacles, SpaceClaim allows analysts to concentrate on their simulations without interruption. With enhanced control over geometry, analysts can foster simulation-driven design, reduce delays between design and analysis teams, and quickly assess how modifications to designs affect outcomes, ultimately leading to more efficient workflows and better project results. Consequently, the integration of SpaceClaim into engineering practices significantly enhances productivity and collaboration.
Description
Ansys Icepak serves as a computational fluid dynamics (CFD) solver specifically designed for managing thermal issues in electronic devices. It offers insights into airflow, temperature distributions, and heat transfer phenomena within integrated circuit packages, printed circuit boards (PCBs), electronic assemblies, and power electronics. By leveraging the top-tier Ansys Fluent CFD solver, Ansys Icepak delivers robust cooling solutions tailored for electronic components, allowing for thorough thermal and fluid flow evaluations. The software operates through the Ansys Electronics Desktop (AEDT) graphical user interface (GUI), facilitating comprehensive analyses of heat transfer involving conduction, convection, and radiation. Moreover, it boasts sophisticated features for modeling both laminar and turbulent flow conditions, as well as conducting species analysis that incorporates radiation and convection effects. Ansys’ extensive PCB design platform empowers users to perform simulations on PCBs, ICs, and packages, enabling a precise assessment of complete electronic systems, thereby enhancing design efficiency and performance optimization. Thus, Ansys Icepak stands out as an essential tool for engineers aiming to improve thermal management in their electronic designs.
API Access
Has API
No
API Access
Has API
No
Integrations
Ansys Electronics Desktop (AEDT)
No
Ansys Fluent
No
Beamy
Yes
BoltsEtAl
Yes
FreeMILL
Yes
Gears
Yes
Innoslate
Yes
Key Ward
Yes
NCG CAM
Yes
PhysicsX
Yes
Integrations
Ansys Electronics Desktop (AEDT)
Yes
Ansys Fluent
Yes
Beamy
No
BoltsEtAl
No
FreeMILL
No
Gears
No
Innoslate
No
Key Ward
No
NCG CAM
No
PhysicsX
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Pricing Details
No price information available.
Free Trial
Yes
Free Version
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
No
Chromebook
No
Deployment
Web-Based
No
On-Premises
No
iPhone App
No
iPad App
No
Android App
No
Windows
Yes
Mac
No
Linux
Yes
Chromebook
No
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Customer Support
Business Hours
Yes
Live Rep (24/7)
No
Online Support
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
Yes
In Person
Yes
Types of Training
Training Docs
Yes
Webinars
Yes
Live Training (Online)
No
In Person
Yes
Vendor Details
Company Name
ANSYS
Founded
1970
Country
United States
Website
www.ansys.com/products/3d-design/ansys-spaceclaim
Vendor Details
Company Name
Ansys
Country
United States
Website
www.ansys.com/products/electronics/ansys-icepak
Product Features
CAD
2 1/2-Axis Milling
No
2D Drawing
Yes
3-Axis Milling
No
3D Modeling
Yes
4-Axis Milling
No
5-Axis Milling
No
Civil
Yes
Collaboration
Yes
Database Connectivity
No
Design Analysis
Yes
Design Export
Yes
Document Management
Yes
Electrical
Yes
Hole Making
Yes
Mechanical
Yes
Mechatronics
Yes
Presentation Tools
Yes
Simulate Cycles
Yes
Spiral Output
Yes
Structural Engineering
No
Toolpath Simulation
Yes
User Defined Cycles
No
Engineering
2D Drawing
No
3D Modeling
No
Chemical Engineering
No
Civil Engineering
No
Collaboration
No
Design Analysis
Yes
Design Export
No
Document Management
No
Electrical Engineering
No
Mechanical Engineering
No
Mechatronics
No
Presentation Tools
No
Structural Engineering
No