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Average Ratings 0 Ratings

Total
ease
features
design
support

No User Reviews. Be the first to provide a review:

Write a Review

Description

The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.

Description

HyperLynx offers integrated capabilities for signal integrity, power integrity, 3D electromagnetic modeling, and electrical rule checking tailored for high-speed digital designs. By merging user-friendly features with automated processes, HyperLynx makes high-speed design analysis accessible for mainstream system designers, enabling early identification and resolution of potential issues within the design cycle. It seamlessly integrates with various PCB tools, making it a valuable addition to any PCB design workflow. The HyperLynx suite ensures a comprehensive analysis pipeline, fusing best-practice design rule checking with in-depth simulations for both signal and power integrity. Equipped with advanced 3D electromagnetic solvers, it produces precise interconnect models that enhance the design process. Users can assess design trade-offs during the pre-layout phase and confirm their designs before fabrication with thorough post-layout analyses. This tool supports a range of applications, including SerDes channels, DDRx memory interfaces, and general signal integrity assessments. Additionally, it simplifies the design and validation of a board's power-delivery network (PDN), facilitating compliance with impedance goals in a user-friendly setting. With its robust features, HyperLynx empowers engineers to create high-performance designs with confidence.

API Access

Has API

API Access

Has API

Screenshots View All

Screenshots View All

Integrations

No details available.

Integrations

No details available.

Pricing Details

No price information available.
Free Trial
Free Version

Pricing Details

No price information available.
Free Trial
Free Version

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Deployment

Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Customer Support

Business Hours
Live Rep (24/7)
Online Support

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Types of Training

Training Docs
Webinars
Live Training (Online)
In Person

Vendor Details

Company Name

Synopsys

Founded

1986

Country

United States

Website

www.synopsys.com/implementation-and-signoff/3dic-design.html

Vendor Details

Company Name

Siemens

Founded

1847

Country

Germany

Website

eda.sw.siemens.com/en-US/pcb/hyperlynx/

Product Features

Product Features

PCB Design

3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor

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