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Average Ratings 0 Ratings
Description
The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.
Description
HyperLynx offers integrated capabilities for signal integrity, power integrity, 3D electromagnetic modeling, and electrical rule checking tailored for high-speed digital designs. By merging user-friendly features with automated processes, HyperLynx makes high-speed design analysis accessible for mainstream system designers, enabling early identification and resolution of potential issues within the design cycle. It seamlessly integrates with various PCB tools, making it a valuable addition to any PCB design workflow. The HyperLynx suite ensures a comprehensive analysis pipeline, fusing best-practice design rule checking with in-depth simulations for both signal and power integrity. Equipped with advanced 3D electromagnetic solvers, it produces precise interconnect models that enhance the design process. Users can assess design trade-offs during the pre-layout phase and confirm their designs before fabrication with thorough post-layout analyses. This tool supports a range of applications, including SerDes channels, DDRx memory interfaces, and general signal integrity assessments. Additionally, it simplifies the design and validation of a board's power-delivery network (PDN), facilitating compliance with impedance goals in a user-friendly setting. With its robust features, HyperLynx empowers engineers to create high-performance designs with confidence.
API Access
Has API
API Access
Has API
Integrations
No details available.
Integrations
No details available.
Pricing Details
No price information available.
Free Trial
Free Version
Pricing Details
No price information available.
Free Trial
Free Version
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Deployment
Web-Based
On-Premises
iPhone App
iPad App
Android App
Windows
Mac
Linux
Chromebook
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Customer Support
Business Hours
Live Rep (24/7)
Online Support
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Types of Training
Training Docs
Webinars
Live Training (Online)
In Person
Vendor Details
Company Name
Synopsys
Founded
1986
Country
United States
Website
www.synopsys.com/implementation-and-signoff/3dic-design.html
Vendor Details
Company Name
Siemens
Founded
1847
Country
Germany
Website
eda.sw.siemens.com/en-US/pcb/hyperlynx/
Product Features
Product Features
PCB Design
3D Visualization
Autorouting
Collaboration Tools
Component Library
Design Rule Check
Differential Pair Routing
Schematic Editor